The field of chip and substrate fabrication may not be the most riveting subject for many people, but the potential advancements it holds for performance and efficiency improvements are certainly noteworthy. Recent reports suggest that major players in the industry, such as AMD, are looking into introducing glass substrates into their chip designs by the mid-2020s. This shift could have significant implications for the future of semiconductor manufacturing.
Using glass substrates instead of organic ones for chiplet-to-chiplet and chip-to-motherboard communication offers a range of benefits. These include a higher interconnect density, faster IO, increased power efficiency, and the ability to accommodate larger package sizes. Glass substrates are known for being flatter, more durable, and easier to work with in terms of lithographic insertion of interconnects.
AMD’s Plans for Glass Substrates
AMD, a major player in the semiconductor industry, is currently evaluating glass substrate samples from various global semiconductor companies with the goal of incorporating this advanced technology into its manufacturing processes. While the timeline for introducing glass substrate chips to the market, likely around 2025 or 2026, may seem ambitious, it aligns with the plans of other industry leaders such as Samsung and Intel.
Industry Trends and Predictions
Samsung and Intel are also looking towards the mid-2020s for mass production of glass substrates. This suggests a potential collaboration between AMD and Samsung to meet the demand for glass substrates in semiconductor manufacturing. While the initial focus may be on big, multi-chip packages rather than consumer desktop chips, the implications for future advancements in AI and HPC data centers are significant.
It is unlikely that the first wave of glass substrate chips will find their way into gaming CPUs or regular desktop chips. These technologies are currently more suited for complex, multi-chip designs rather than consumer-grade products. AMD’s EPYC lineup, designed for AI and HPC applications, is likely to benefit the most from these advancements in substrate technology.
As the semiconductor industry continues to push the boundaries of innovation, the introduction of glass substrates into chip fabrication processes represents a significant step forward. While the timeline for widespread adoption may still be a few years away, the potential benefits in terms of performance, efficiency, and scalability are too great to ignore. Keeping an eye on industry trends and advancements will be crucial for staying ahead in this rapidly evolving field.
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